PCB Assembly
MIXED & AUTOMATED
Technology Assemblies
Novatronix utilizes leading-edge manufacturing technologies to offer integrated turnkey solutions along with cosigned and kitted assemblies.
YOUR
Contract Manufacturing Partner
We provide advanced PCB assembly solutions at our US-based manufacturing facility and continue to make significant investments in order to obtain the latest equipment.
Our multiple assembly lines perform densely populated high-mix component placement with quickness, accuracy, and little to no fallout. Our sophisticated high-speed equipment employs SPC and real-time product tracking, ensuring the manufacturing efficiency that results in on-time delivery. We also have overseas global production capabilities to meet your manufacturing needs.
Automated PTH Assembly
Fine Pitch SMT Assembly
BGA Assembly
Mixed Technology Assembly
Selective Soldering
Lead-Free & RoHS Assembly
Cable Assembly
In Circuit Testing
Functional Testing
Conformal Coating/Potting
Box Build Assembly
System Integration
Our Juki KE2060 component placement systems offer the latest technology, giving us accuracy and reliability in bare board component placement.
Ranging from package sizes as small as 01005 to as large as 150mm, we have a wide range of component and board handling options not available elsewhere. Its high-precision vision centering and laser alignment system gives it the ability to place components with a 0.001" accuracy at a rate of 12,500 components per hour.
SMT
Placement Equipment
Performs high mix assemblies at high speeds
Continuous production and short batch capability
Great accuracy and flexibility
Fast setups and changeovers
Places components as small as 01005
Places BGA's and Micro BGA's
Capable of placing 12,500 components per hour
The KISS-103 automated selective soldering machine designed to solder connectors and through hole parts without disturbing nearby SMT components.
This equipment overcomes the limitations of operator-dependent soldering while significantly increasing the solder joint quality, coupling high throughput with precise process controls.
NOVATRONIX'S
Selective Solder
Selectively solders Through-Hole components
Significantly superior to hand soldering
Provides a consistently excellent solder wave shaped
Accuracy of +/- 0.002"
Eliminates icicles and solder bridges
Process up to 18" x 48" PCB panel size
Tin/Lead and RoHS compatible
Capable of handling fine-pitch gold plated QFP's
Our advanced AOI machine (YesTech F1) inspects solder-joints and verifies correct part assembly, enabling us to increase throughput while maintaining a high level of quality. Its two top-down viewing cameras and four side viewing cameras offer high-speed PCB inspection and exceptional defect coverage. It is equally effective for bare PCB, past, pre/post-reflow, and final assembly inspection giving us a full, complete inspection solution.
Our AOI machine checks that all components are positioned in their correct locations, and also checks for quality defects such as incorrect skew, tombstoning, bent leads, lifted pads, and solder bridging on components with package sizes as small as 0201 and 01005.
AUTOMATED
Optical Inspection
Inspect electronic and sealed assemblies
Solder Defects
Lead Defects
Component Presence & Position
Correct Part Placement
Correct Polarity
Through Hole & SMT Parts
Paste
The high-resolution Scienscope X-Ray allows complete inspection of critical hidden features and solder joints underneath SMT and semiconductor packages as well as components under radio frequency (RF) shields.
Its image processing technology integrates several techniques and inspection algorithms to provide complete inspection coverage, effective for complex boards populated with BGA's, column grid arrays (CGAs), chip-scale packages (CSPs), and other advanced packages. It also detects insufficient solder, voiding, shorts, and opens in areas that are not visible.
OUR
X-Ray Inspection
Inspect electronic and sealed assemblies
Process up to 18" x 20" PCB panel size
Inspects visible and hidden solder-joints
Detects BGA shorts, voids, position, and missing balls
Inspects component packages as small as 0201 and 01005
Flip Chip inspection
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Contact Us Today!
Give us a call at (630) 860-4300
or contact us to get more information!